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Biographie et livres d'Yong Liu

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Professor Liu received his Ph.D. from the Institute of Chemistry, Chinese Academy of Science, in 2005. Then he worked at Tsinghua University as a post-doctor for more than two years. In 2011, he went to Cornell University as a visiting associate professor and worked there for a whole year. His researches mainly focus on the preparation and application of polymer and its nanocomposites. In detail, his research fields include the application of high-performance engineering plastics, performance
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Dernière parution

Téléchargez le livre :  Electrospinning for Proton Exchange Membrane Fuel Cells
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Electrospinning for Proton Exchange Membrane Fuel Cells

Yong Liu , Meerasahib Mohamedazeem


Wiley-VCH

2025-09-03

PDF, ePub

Comprehensive reference on the design, characteristics, performance, and development potential of key components of PEMFC through electrospinning technologies Electrospinning for Proton Exchange Membrane Fuel Cells discusses the use of electrospun...

137,80

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Télécharger le livre :  Value in Business
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This book uses a system-based approach to decipher and organize the concepts and conclusions relevant for creating and capturing value in business.  It develops a scientific theory based on systems science and logical reasoning that is commonly employed in...

Editeur : Springer
Parution : 2021-10-22
Collection : Contributions to Management Science
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137,79
Télécharger le livre :  Advances in Innovative Geotechnical Engineering
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With the development of social and science, new requirements are put forward for geotechnical engineering. Advanced geotechnical techniques were proposed to solve the new challenges in geotechnical engineering. The articles presented in this volume aim to the new...

Editeur : Springer
Parution : 2021-07-23
Collection : Sustainable Civil Infrastructures
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169,59
Télécharger le livre :  Artificial Intelligence Algorithms and Applications
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This book constitutes the thoroughly refereed proceedings of the 11th International Symposium on Intelligence Computation and Applications, ISICA 2019, held in Guangzhou, China, in November 2019.The 65 papers presented were carefully reviewed and selected from  the...

Editeur : Springer
Parution : 2020-05-25
Collection : Communications in Computer and Information Science
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105,99
Télécharger le livre :  Advances in Natural Computation, Fuzzy Systems and Knowledge Discovery
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This book discusses the recent advances in natural computation, fuzzy systems and knowledge discovery. Presenting selected, peer-reviewed papers from the 15th International Conference on Natural Computation, Fuzzy Systems and Knowledge Discovery (ICNC-FSKD 2019), held...

Editeur : Springer
Parution : 2019-11-06
Collection : Advances in Intelligent Systems and Computing
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211,99
Télécharger le livre :  Advances in Natural Computation, Fuzzy Systems and Knowledge Discovery
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This book discusses the recent advances in natural computation, fuzzy systems and knowledge discovery. Presenting selected, peer-reviewed papers from the 15th International Conference on Natural Computation, Fuzzy Systems and Knowledge Discovery (ICNC-FSKD 2019), held...

Editeur : Springer
Parution : 2019-11-06
Collection : Advances in Intelligent Systems and Computing
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253,34
Télécharger le livre :  Current Geotechnical Engineering Aspects of Civil Infrastructures
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This book deals with the attempts made by the scholars and engineers to address contemporary issues in geotechnical engineering such as characterization of geomaterials, slope stability and tunneling, sustainability in geohazards and some other geotechnical issues that...

Editeur : Springer
Parution : 2018-07-12
Collection : Sustainable Civil Infrastructures
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137,79
Télécharger le livre :  Wafer-Level Chip-Scale Packaging
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Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling. Recent advances in analog and power electronic WLCSP packaging are presented based on...

Editeur : Springer
Parution : 2014-09-10

ePub

158,99
Télécharger le livre :  Power Electronic Packaging
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Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power...

Editeur : Springer
Parution : 2012-02-15

ePub

253,34